{"id":183950,"date":"2019-08-22T06:30:36","date_gmt":"2019-08-21T22:30:36","guid":{"rendered":"\/\/m.iemloyee.com\/?p=183950"},"modified":"2019-08-21T11:56:45","modified_gmt":"2019-08-21T03:56:45","slug":"%e3%80%90%e6%8a%95%e7%a8%bf%e3%80%91%e5%8d%97%e4%ba%ac%e5%a4%a7%e5%ad%a6%e4%bd%99%e6%9e%97%e8%94%9a%e6%95%99%e6%8e%88%e8%af%be%e9%a2%98%e7%bb%84%e7%a0%94%e7%a9%b6%e6%88%90%e6%9e%9c%ef%bc%9a%e5%8f%af","status":"publish","type":"post","link":"\/\/m.iemloyee.com\/?p=183950","title":{"rendered":"\u5357\u4eac\u5927\u5b66\u4f59\u6797\u851a\u6559\u6388\u8bfe\u9898\u7ec4\u7814\u7a76\u6210\u679c\uff1a\u53ef\u62c9\u4f38\u6676\u7845\u7f51\u683c\u6280\u672f"},"content":{"rendered":"

\u3010\u524d\u8a00\u3011<\/strong><\/p>\n

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\u3010\u6210\u679c\u7b80\u4ecb\u3011<\/strong><\/p>\n

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\u3010\u56fe\u6587\u5bfc\u8bfb\u3011<\/strong><\/p>\n

\"\"<\/p>\n

\u56fe\uff081\uff09\u901a\u8fc7\u6c9f\u9053\u5f62\u8c8c\u8c03\u63a7\u548c\u53ef\u9760\u89c4\u6a21\u96c6\u6210\u5b9e\u73b0\u7684\u53ef\u62c9\u4f38\u6676\u7845\u7eb3\u7c73\u7f51\u683c\u7ed3\u6784<\/p>\n

\u4ee5\u4e0a\u7814\u7a76\u6210\u679c\u8fd1\u671f\u53d1\u8868\u5728\u300aNano<\/i><\/b><\/em><\/strong>\u00a0Letters<\/i><\/b><\/em><\/strong>\u300b,\u00a0\u300aAdva<\/i><\/b><\/em><\/strong>nced Electronic Materials<\/i><\/b><\/em><\/strong>\u300b\u548c\u300anpj 2D Materials and Applications<\/i><\/b><\/em><\/strong>\u300b\u4e0a\uff1a\u00a0<\/p>\n

<\/b>1. Monolithic integration of silicon nanowire networks as a soft wafer for highly stretchable and transparent electronics,Taige Dong, Ying Sun, Zhimin Zhu, Xiaoxiang Wu, Junzhuan Wang, Yi Shi, Jun Xu, Kunji Chen and Linwei Yu*<\/b><\/strong>.\u00a0<\/b><\/strong>Nano Letters<\/i><\/b><\/em><\/strong>, accepted, <\/b><\/strong>DOI: 10.1021\/acs.nanolett.9b02291 (2019)
\n https:\/\/pubs.acs.org\/doi\/10.1021\/acs.nanolett.9b02291<\/u><\/a><\/p>\n

2. 3D sidewall integration of ultra-high density silicon nanowires for stacked channel electronics<\/span><\/p>\n

Xiaoxiang Wu, Haiguang Ma, Han Yin, Danfeng Pan, Junzhuan Wang, Linwei Yu,*<\/b><\/strong>Jun Xu, Yi Shi, Kunji Chen.\u00a0Adva<\/i><\/b><\/em><\/strong>nced Electronic Materials<\/i><\/b><\/em><\/strong>,\u00a01800627\u00a0(2019)<\/p>\n

https:\/\/onlinelibrary.wiley.com\/doi\/full\/10.1002\/aelm.201800627<\/u><\/a>\u00a0<\/p>\n

3. Highly stretchable graphene nanoribbon springs by programmable nanowire lithography<\/span><\/p>\n

Chuan Liu, Bing Yao, Taige Dong, Haiguang Ma, Shaobo Zhang, Junzhuan Wang, Jun Xu, Yi Shi, Kunji Chen, Libo Gao*and\u00a0Linwei Yu<\/b><\/strong>*<\/b><\/strong>.\u00a0npj 2D Materials and Applications 3<\/i><\/b><\/em><\/strong>, 23 (2019)
\n https:\/\/www.nature.com\/articles\/s41699-019-0105-7<\/u><\/a>\u00a0<\/p>\n

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\u672c\u6587\u7531\u5357\u4eac\u5927\u5b66\u4f59\u6797\u851a\u6559\u6388\u8bfe\u9898\u7ec4<\/strong>\u4f9b\u7a3f\u3002<\/p>\n

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